ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,995, issued on June 3, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Electric power supply system having a bidirecttional electric p... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,362, issued on June 3, was assigned to JEAN CULTURAL & CREATIVE Co. LTD. (New Taipei, Taiwan). "Music box" was invented by Ming-Te Lai (New ... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,320,849, issued on June 3, was assigned to Realtek Semiconductor Corp. (Hsinchu, Taiwan). "Clock control circuit and method" was invented by Yu-... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,323,305, issued on June 3, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Policy determining method and apparatus" was invente... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. D1,077,821, issued on June 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea). "Monitor" was invented by Sangyoung Lee (Suw... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,293, issued on June 3, was assigned to Sony Group Corp. (Tokyo). "Apparatuses and methods for collision avoidance" was invented by Henrik Sc... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,743, issued on June 3, was assigned to Dyne Therapeutics Inc. (Waltham, Mass.). "Complexes comprising an anti-transferrin receptor antibody ... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,295, issued on June 3. "Complex nanostructure forming a bidirectional nanostructure multiplexer or artificial neuron" was invented by Jerry ... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,323,897, issued on June 3, was assigned to AT&T Intellectual Property I LP (Atlanta). "Connectionless mobility management for hybrid networks us... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,563, issued on June 3, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor package with metal column mold barrier" was invented ... Read More